DIAMOND HEAT SINKS IMPROVE SEMICONDUCTOR PERFORMANCEE&MP123.002 Semiconductors March 19, 1968 A triangular diamond heat sink (center) improves the performance of a gallium arsenide injection laser. The laser is the rectangular piece between the heat sink and the ball contact. A metal spring presses down on the ball contact, insuring good electrical contact to the semiconductor. The diamond heat sink, about two millimeters on a side, is mounted on a piece of tin-plated copper. During mounting the tin is melted, forming the mottled pattern on the side of the substrate.
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