DIAMOND HEAT SINKS IMPROVE SEMICONDUCTOR PERFORMANCE
March 19, 1968
A triangular diamond heat sink (center) improves the performance of a gallium arsenide injection laser. The laser is the rectangular piece between the heat sink and the ball contact. A metal spring presses down on the ball contact, insuring good electrical contact to the semiconductor. The diamond heat sink, about two millimeters on a side, is mounted on a piece of tin-plated copper. During mounting the tin is melted, forming the mottled pattern on the side of the substrate.